Electronic Design Products of the Week (11/11-11/15)

<p><a href="https://www.belfuse.com" style="color:blue; text-decoration:underline" target="_blank"><span style="color:#e67e22">Stewart Connector</span></a> expanded its SealJack PCB Mount Series with a new right-angle USB connector. The series of connectors is designed to be used in outdoor applications or additional environments, where they may be exposed to moisture and water. The connectors carry an IP67 rating, meaning they’re guaranteed to operate in water up to one meter deep for at least a half hour. In addition, the connector is dust-resistant. It can operate at speeds up to 480 Mb/s, is shielded, and is RoHS-compliant., Molded in high temperature plastic, the connector includes gold plating on the contacts and is housed in a zinc diecast alloy with tin plating.</p>

<p>New metallized polypropylene filmed capacitors developed by <a href="https://www.tdk-electronics.tdk.com" style="color:blue; text-decoration:underline" target="_blank"><span style="color:#e67e22">TDK</span></a> target high-power ac filtering applications. The B32354S3 series are designed to operate with ac voltages up to 350 V and are available in values from 10 to 40 µF in increments of 5 µF. The capacitors are UL 810-approved, rated for temperatures up to 85°C, and humidity-protected for 1000 hours at 85% relative humidity. Depending on the component chosen, the case size will vary as well as the peak current-handling capabilities. For example, the 10-µF caps come in a 28- × 35- × 57.5-mm package and can handle RMS currents of 7 A and peak currents up to 300 A. On the other hand, the 40-µF caps come in a 50- × 55- × 57.5-mm package and can handle RMS currents of 17 A and peak currents of 1100 A.</p>

<p>The new Linea ML family of multiline CMOS cameras from <a href="http://www.teledynedalsa.com" style="color:blue; text-decoration:underline" target="_blank"><span style="color:#e67e22">Teledyne</span></a> has been designed to offer multiple functionalities such as HDR and multiple spectral-band options (e.g., multi-field, color, color plus mono, and color plus NIR). Operation in single or multiple rows are possible while the HDR functionality allows captures of bright and dark scenes with high dynamic range. Improved sensitivity, noise, and higher line rates up to 300 kHz are made possible through a native CLHS interface. In addition, Linea ML will be the first family of cameras from Teledyne to support fiber-optic connections. The cameras are well-suited for machine-vision applications.</p>

<p>One of <a href="https://www.ironwoodelectronics.com/" style="color:blue; text-decoration:underline" target="_blank"><span style="color:#e67e22">Ironwood Electronics</span></a>’ more recent advances is a new BGA socket designed to fit 23 x 32-mm BGA packages with 1mm pitch. A critical part of all IC sockets is the parasitic performance since this can degrade and complicate measurements. The SG-BGA-6485 features 150 pH of self-inductance and 25 pH of mutual inductance. Furthermore, each pin can handle up to 2 A of current and maintain a low parasitic capacitance of just 10 fF. Each pin is able to operate up to a 27 GHz BW with only 1 dB of insertion loss. The product comes mounted on a PCB and features a swivel lid and ball guide for precision alignment. The SG-BGA-6485 sockets are available for $936 each.</p>

<p><a href="https://www.renesas.com" style="color:blue; text-decoration:underline" target="_blank"><span style="color:#e67e22">Renesas</span></a> demonstrated the capability to detect materials (liquid and solid) using its RX130 capacitive touch-key MCUs. The solution measures capacitance by connecting electrodes using the RX130. As a result, it’s able to take advantage of the RX130’s improved noise immunity, high sensitivity, and water resistance. These features are what allows the device to detect materials such as fine powders—small changes in the amount of powder between the electrodes will cause a slight change in capacitance to be detected. By applying an approach that uses electrodes instead of sensors, designers can lower their bill-of-materials costs and use a single MCU to allow for multiple detection points. The material-detection solution is now available along with sample programs and circuit diagrams.</p>